ROCKCHIP RK3576: New Generation Platform Chip with Advanced Interfaces and Features

 

***NOTE: The features and specifications mentioned in this article may not fully reflect the actual product details. For the most accurate and up-to-date information, please consult the official documentation.***

Introduction to the Latest ROCKCHIP Innovation

ROCKCHIP’s RK3576 is a new general-purpose SOC product launched in the second quarter of 2024. Built on an advanced 8nm process, this chip operates with low CPU junction temperature (Tj), supporting applications without a heat sink. It simultaneously supports multiple peripherals and numerous IO ports to meet the requirements of various applications.

rk3576 block diagram
rockchip rk3576 block diagram

CPU Architecture and Performance

The RK3576 features an eight-core architecture with four ARM Cortex-A72 high-performance cores and four Cortex-A53 efficiency cores, plus an M0 co-processor. This configuration delivers computing power of 58K DMIPS.

  • A72 cores: Maximum frequency up to 2.3GHz
  • A53 cores: Maximum frequency up to 2.2GHz
  • Supports Arm CoreLink CCI-500 cache coherent interconnect
  • MCU co-processor: ARM Cortex-M0 with 400MHz main frequency
  • Coremark benchmark performance: 658 points

The CPU architecture is designed for AMP (Asymmetric Multi-Processing) heterogeneous systems, making the RK3576 particularly suitable for display and control integration.

GPU Capabilities

The 3D graphics engine employs ARM Mali-G52 MC3 at 950MHz, supporting:

  • OpenGL ES 1.1, 2.0, and 3.2
  • Vulkan 1.2
  • OpenCL 2.0
  • AFBC (ARM Frame Buffer Compression)
  • Dual-core Rockchip RGA V2.5 engine for 2D graphics processing

rockchip rk3576 GFX bench mark

Neural Network Processing Unit (NPU)

The RK3576 incorporates ROCKCHIP’s self-developed latest iteration NPU:

  • Dual-core NPU providing 6TOPS@INT8 computing power
  • Support for parallel multi-tasking
  • Computation support for INT4, INT8, INT16, FP16, BF16, and TF32
  • Compatible with multiple deep learning frameworks including TensorFlow, TF-lite, PyTorch, Caffe, ONNX, MXNet, Keras, Darknet, and Android NN

Memory Support

Internal Memory

  • BootROM supporting boot from FSPI Flash, eMMC, SDMMC, UFS, USB, and other storage devices
  • USB OTG firmware download support
  • 32KB PMU_SRAM for low-power applications and 512KB SYS_SRAM for general applications

External Memory

  • LPDDR4/LPDDR4X with 4266Mbps bandwidth
  • LPDDR5 with 4800Mbps bandwidth
  • 32-bit data width, 2 RANK data blocks, maximum support for 16GB capacity

Storage Device Support

  • eMMC V5.1, HS400, HS200, DDR50, data width 1/4/8 bit
  • SD3.0, MMC V4.51
  • New UFS2.0 support, dual-channel, each channel supporting HS-G3 5.8Gbps transmission rate
  • FSPI flash interface supporting serial flash interfaces, NOR, NAND, pSRAM, SRAM devices

Video Codec Capabilities

Video Decoder

Supports parallel multi-stream decoding:

  • H.264/AVC (main10, L5.2) at 4K@60fps
  • H.265/HEVC (main10, L6.0) at 8K@30fps or 4K@120fps
  • VP9 (Profile 0/2, L6.0) at 8K@30fps or 4K@120fps
  • AVS2 (Profile 0/2, L8.2.120) at 8K@30fps or 4K@120fps
  • AV1 (main10, L6.0) at 8K@30fps or 4K@120fps

Video Encoder

  • Supports H.264/H.265 at maximum resolution of 4K@60fps
  • RK3576 is currently one of only two chips besides RK3588 that can support 4K60 encoding
  • Supports parallel multi-stream encoding

Display Interfaces

Video Input Interfaces

MIPI-CSI2

  • Supports up to 5 MIPI CSI-2 interfaces
  • 4 D-PHY V1.2 x 2lane, each lane 2.5Gbps or 2 x 4Lane flexible configuration
  • 1 x 4Lane D-PHY or 3trio C-PHY
  • D-PHY V2.0 with 4.5Gbps per lane
  • C-PHY V1.1 with 2.5Gbps per trio
  • Each interface supports four virtual channels, maximum 20 virtual channels total
  • Built-in VICAP and ISP, MIPI CSI RX input data can be processed via VICAP, ISP
  • ISP V3.9 supports 16M@30fps camera sensor
  • RK3576 adds support for RGB-IR camera sensors

Video Output Interfaces

HDMI (combo with eDP)

  • Supports HDMI V2.1, maximum output resolution 4K120
  • Supports HDCP V2.3 and V1.4

eDP (combo with HDMI)

  • Simultaneously supports eDP V1.3 and DP V1.2
  • Maximum output resolution 4K60
  • Supports HDCP V1.3

DP (combo with USB3)

  • Supports DP V1.4, USB TYPE C DP ALT mode
  • Maximum output resolution 4K120
  • Supports HDCP V2.3 and 1.4
  • New DP MST functionality for multi-video streaming
  • Supports daisy chain and MST hub architectures

MIPI DSI

  • Provides one MIPI-DSI2 V1.1 group supporting both D-PHY V2.0 and C-PHY V1.1
  • Supports 4 lanes of D-PHY or 3 trios of C-PHY
  • Maximum resolution 2560×1600@60Hz
  • Maximum color depth 10bit

Parallel RGB/BT.656/BT.1120

  • Maximum resolution 1920×1080@60Hz
  • Maximum color depth 8bit

EBC

  • Upgraded EBC output interface
  • Supports E-ink interface for electronic paper displays
  • Maximum resolution 2560×1600@60Hz
  • 16-bit data width
  • Maximum support for 32-level grayscale display
  • Supports direct connection, LUT mode, and 3 window mode
  • Supports window mode

Image Processor

  • Provides 3 independent Video Ports, supporting three different screen displays
  • Video Port0 supports 4K120Hz, 10bit data
  • Video Port1 supports 2560×1400@60Hz, 10bit data
  • Video Port2 supports 1920×1080@60Hz, 8bit data
  • Each Video Port can arbitrarily use HDMI/eDP/DP/MIPI DSI-2 interface output
  • Parallel output interface can only use Video Port1 and Video Port2

Peripheral Interfaces

Ethernet

  • Built-in two MAC 10/100/1000 Ethernet controllers, supporting RGMII interface
  • Supports full-duplex and half-duplex operation
  • Both GMACs support IEEE.1588 with nanosecond-level precision
  • New TSN (Time-Sensitive Networking) support

I3C

  • I3C is one of the newly added interfaces in RK3576
  • Provides two I3C interfaces, supports SDR mode, transmission speed up to 12.5Mbps, compatible with I2C
  • Supports multi-master devices, up to 11 devices
  • Supports software interrupts, hot-plugging

DSMC Double Data Rate Serial Interface

  • New interface for PSRAM memory expansion and connecting FPGA interface devices
  • 4 independent data channels, transmission rate 370MB/s
  • Latency below 400ms
  • Addressing modes: 8/16bit
  • Supports 8/16 line mode, 3 clock modes (normal, always-on, no-edge-clk)
  • Supports immediate DMA data transfer upon interrupt reception

CAN

  • RK3576 provides 2 newly iterated CAN interfaces
  • Supports CAN and CAN FD protocols
  • New support for 8192-bit FIFO reception

FlexBus Interface

  • RK3576 provides two FlexBus interfaces
  • New FlexBus interface can simulate standard protocols like CIF/QSPI/SPI or non-standard protocols
  • Data width configurable 2/4/8/16bit, clock frequency 100MHz
  • Primarily used for interfaces requiring fast data input and output, and for developing proprietary protocols

rk3576 flexbus block chart

UART Controller

  • Provides 12 UART interfaces
  • Built-in 2 independent 64-byte FIFOs for TX and RX
  • Supports 5bits, 6bits, 7bits, 8bits serial data transmission and reception
  • Each UART can support different input frequencies, maximum transmission rate up to 8Mbps
  • All except UART0 support auto flow control mode and new RS485 automatic switching of send/receive direction

PWM Controller

  • 16 PWM channels
  • New support for High-Speed Signal Pulse Counter (HSC)
  • Bidirectional counter and waveform generator that can produce waveforms without CPU dependency

Other IO Features

GPIO

  • Provides 5 GPIO groups, each with 32 pins
  • Each 32-pin group can be divided into 4 groups with one interrupt assignable to each
  • RK3576 supports a total of 20 interrupts, significantly more than previous chips
  • Enhanced flexibility and optimization for AMP heterogeneous solutions

Temperature Sensor (TSADC)

  • Upgraded TS-ADC with more channels and improved precision
  • Supports 6 channels, sensing temperature range -40~125°C, accuracy 1°C
  • New support for user-defined mode and automatic mode

Successive Approximation ADC (SARADC)

  • Upgraded SAR-ADC precision
  • Resolution increased to 12 bits
  • Maximum 1MS/s sampling frequency
  • Provides 8 input channels

Package Type

  • FCCSP698L (body: 16.1mm x 17.2mm; ball size: 0.3mm; ball pitch: 0.55mm&0.60mm&0.65mm mixed)

Industrial and Automotive Variants

  • RK3576J: Industrial grade operating temperature -40~85°C, suitable for power concentrators/energy controllers/specialized collection terminals, HMI, PLC control, and various gateways
  • RK3576M: Meets -40~85°C operating temperature and AEC-Q100 specifications, suitable for intelligent cockpit and other automotive application areas

rk3576 SoC antutu performance